Global Automotive DCU Industry 2019-2020 with a Focus on the Chinese Market – Features Detailed Profiles of 11 Global & 10 Chinese DCU Vendors
September 11, 2020
DUBLIN, Sept. 9, 2020 /PRNewswire/ — The “Automotive Domain Control Unit (DCU) Industry Report, 2019-2020” report has been added to ResearchAndMarkets.com’s offering.
Domain control unit shipments will boom in 2021
When the one-to-one correspondence between the growing number of sensors and electronic control units (ECU) leads to underperforming vehicles and adds circuit complexity, more powerful centralized architectures like domain control unit (DCU) and multi-domain controller (MDC) come as an alternative to the distributed ones.
As concerns the tendency of domain controller, Vector conceives three stages of E/E architecture development: controller-centric, DCU, and central computer. Intelligent vehicle will ultimately be a mobile super computer and data center, and a new Wintel will come into being. In future, computing platform, operating system and application software will matter the most to the highly automated vehicles multimedia multi-domain controllers and central domain controllers are likely to be combined into one.
In response to the disruption, Volkswagen plans adoption of a unified automotive E/E architecture BMW will introduce central communication services and service-oriented architecture (SOA) in its next-generation E/E architecture the smart vehicle architecture (SVA) launched by Aptiv breaks the bottleneck of conventional architectures, providing frame scalability for next-generation intelligent vehicles. The new E/E architectures will be built on the concept of central computer-layer-area, embodying the philosophy of SOA.
As to DCU, next-generation smart cockpit system based on cockpit DCU enables functionality of cockpit electronic system on a unified software and hardware platform. Cockpit electronic system offering intelligent interaction and scenarios as well as personalized services, will be a foundation for human-vehicle interaction and vehicle-to-everything (V2X) communication. Visteon argues that by 2023, intelligent cockpit integrated with LCD dashboard, center console and co-pilot infotainment system will be based entirely on single-ECU domain control platform.
Globally, Visteon, Continental, Bosch and Aptiv dominate the cockpit DCU market. Chinese players like Huawei, Desay SV, Shenzhen Hangsheng Electronics and Neusoft race to unveil their cockpit DCU solutions.
As for cockpit chip, typical products are comprised of Qualcomm 820A, Intel Atom, NXP i.MX8, Renesas R-CAR H3 and TI Jacinto family. Notably, the prevailing Qualcomm 820A processor platform has been ordered by 18 out of the 25 world-renowned OEMs, with the order intake recording $5.5 billion or so.
In the ADAS/AD DCU market, most of those in use for Level 1 driving assistance employ separate ECU to control. ADAS ECU which is developed mainly for Level 2 driving assistance is utilized to combine LDW/LKA and AEB. It is in the era of Level 2+, Level 3 and Level 4 automated driving that the demand for autonomous driving domain control unit (AD DCU) will be soaring.
Tier-1 suppliers worldwide already deploy ADAS/AD DCU such as Visteon DriveCore, Bosch DASy, Continental ADCU, ZF ProAI, Veoneer Zeus and Magna MAX4. In China, such typical products include iECU (co-developed by SAIC and TTTech), Huawei MDC (MobileData Center) intelligent driving DCU, IN-DRIVING TITAN, and Neusoft Reach CPDC-II DCU/CPDC-III central computer.
When it comes to autonomous driving chip, Nvidia is absolutely the leader with Nvidia Drive PX2 and Nvidia Drive Xavier being widely deployed by vendors. In December 2019, Nvidia introduced DRIVE AGX Orin, a software-defined platform for Level 5 automated driving, with nearly 7x the performance of the previous generation SoC Xaiver. The Orin SoC integrates NVIDIA’s next-generation GPU architecture and Arm Hercules CPU cores, as well as new deep learning and computer vision accelerators that, in aggregate, deliver 2,000 TOPS.
Other autonomous driving chips include TI TDA4, Qualcomm Snapdragon Ride, NXP S32 family, and Mobileye EyeQ family.
In the next three to five years, among DCU market segments, cockpit DCU will see a faster growth rate and a larger market than autonomous driving DCU because it is easier to spawn cockpit DCUs at lower cost the surging demand for intelligent cockpits, which is fueled by the availability of 5G in vehicles, will drive up cockpit DCU shipments to explode in 2021 on the basis of OEM’s and Tier1’s progress in mass production.
In the ADAS/AD DCU field, inadequate regulations and immature technologies will expectedly make it hard to apply Level 3/Level 4 automated driving technologies on large scale in the upcoming three to five years. OEMs, tier-1 suppliers and chip vendors are working to mass produce L2+ autonomous vehicles. It is predicted that production of Level 3/Level 4 autonomous vehicles will peak around 2025, but business-oriented vehicles will play the key role, with roughly 5 million units of ADAD/AD DCUs for passenger cars to be shipped worldwide in 2025.
Key Topics Covered
1 ECU to DCU 1.1 ECU 1.1.1 Definition of ECU 1.1.2 Typical Block Diagram of Automotive Electronics Control Circuit 1.1.3 Automotive ECU Industry Chain 1.1.4 Development of ECU 1.1.5 ECUs Increase and DCU Debuts 1.2 DCU 1.2.1 Definition of DCU 1.2.2 Five Typical DCUs 1.2.3 Why to Use DCUs 1.2.4 Main Functions of DCU 1.2.5 Development Trends of DCU 1.2.6 DCU Ecosystem 1.2.7 Global Passenger Car DCU (Cockpit + Autonomous Driving) Market Size 1.2.8 High Performance SoC Processors Boost DCU Market
2 Automotive Electronic/Electrical Architecture (EEA) 2.1 Development Trends of EEA 2.1.1 Evolution of EEA 2.1.2 Development Trends of EEA 2.1.3 Three Stages of Future EEA Development 2.1.4 Integration Trends of EEA 2.1. Development Trends of New-EEA-based Intelligent Vehicles 2.1.6 Core Technologies for Redefined Intelligent Vehicle (1) 2.1.7 Core Technologies for Redefined Intelligent Vehicle (2) 2.1.8 Core Technologies for Redefined Intelligent Vehicle (3) 2.1.9 Core Technologies for Redefined Intelligent Vehicle (4) 2.1.10 Core Technologies for Redefined Intelligent Vehicle (5) 2.1.11 Core Technologies for Redefined Intelligent Vehicle (6) 2.2 Development Trends of Tier1’s EEA 2.2.1 Bosch EEA Evolution Strategy 2.2.2 Bosch Intelligent Vehicle Multi-domain Architecture 2.2.3 Aptiv Smart Vehicle Architecture (SVA) 2.2.4 Aptiv EEA Evolution Strategy 2.2.5 Continental Distributed EEA 2.2.6 NXP Next-generation EEA 2.3 Development Trends of OEM’s EEA
3 Intelligent Cockpit DCU 3.1 Development Trends of Intelligent Cockpit DCU 3.1.1 3 ECUs in a Convectional Cockpit System can be Integrated into an Intelligent Cockpit DCU 3.1.2 Cockpit Domains before and after 2020 3.1.3 Example of Complex Intelligent Cockpit DCU Design 3.1.4 Visteon’s Prediction of Intelligent Cockpit DCU Market 3.2 Intelligent Cockpits and DCU Solutions 3.2.1 Comparison between Main Foreign Cockpit Platform Solutions 3.2.2 Comparison between Main Cockpit Platform Solutions in China 3.2.3 Solutions and Customers of Typical Cockpit DCU Vendors 3.2.4 Main Automotive Intelligent Cockpit Platforms of OEMs and Their Suppliers Worldwide 3.3 Intelligent Cockpit Processors 3.3.1 Mainstream Intelligent Cockpit Processors in Current Market 3.3.2 Qualcomm Cockpit Processors 3.3.3 Qualcomm Snapdragon Cockpit Processors 3.3.4 Renesas Cockpit Processors 3.3.5 Intel Cockpit Processors 3.3.6 NXP Cockpit Processors 3.3.7 TI Cockpit Processors 3.3.8 Samsung Cockpit Processors 3.3.9 Allwinnertech Technology’s Cockpit Processors 3.3.10 MediaTek Cockpit Processors 3.3.11 Horizon Robotics’ Cockpit Processors
4 ADAS/AD DCUs and Chips 4.1 Development Trends of ADAS/AD DCU 4.1.1 ADAS Distributed ECU and ADAS/AD DCU 4.1.2 Overview of ADAS/AD DCU 4.1.3 Visteon’s Prediction of ADAS/AD DCU Market 4.1.4 Typical Architecture Solutions of ADAS/AD DCU 4.1.5 Development Trends of Autonomous Driving DCU 4.2 ADAS/AD DCU Solutions 4.2.1 Typical ADAS/AD DCUs (13) 4.2.2 List of Foreign Vendors’ Layout of ADAS/AD DCU (1) 4.2.3 List of Foreign Vendors’ Layout of ADAS/AD DCU (2) 4.2.4 List of Foreign Vendors’ Layout of ADAS/AD DCU (3) 4.2.5 List of Chinese Vendors’ Layout of ADAS/AD DCU (1) 4.2.6 List of Chinese Vendors’ Layout of ADAS/AD DCU (2) 4.2.7 Main Automakers’ ADAS/AD DCU Platforms and Suppliers Worldwide 4.3 ADAS/AD DCU Chips 4.3.1 DCU Chip Vendor: NVIDIA 220.127.116.11 NVIDIA Drive Ecosystem 18.104.22.168 NVIDIA Drive Autonomous Driving Chip Portfolios 22.214.171.124 NVIDIA Software-defined Automotive Platform 126.96.36.199 NVIDIA’s Technology Cooperation 4.3.2 DCU Chip Vendor: TI 188.8.131.52 TI Autonomous Driving Chip Architecture 184.108.40.206 TI Launched New Chips for ADAS 220.127.116.11 TI Autonomous Driving Chips 4.3.3 DCU Chip Vendor: Renesas 18.104.22.168 Renesas R-Car 22.214.171.124 Renesas Autonomous Driving Chips 126.96.36.199 Renesas L4 Computing Platform Architecture 188.8.131.52 Renesas Autonomy Platform 4.3.4 DCU Chip Vendor: Qualcomm 4.3.5 NXP DCU Chip Vendor: NXP 184.108.40.206 Application of NXPS32 Family Product Lines 220.127.116.11 NXPS32 Family: Based on ARM Cores 18.104.22.168 NXPS32 Family: Applied in ADAS and Autonomous Driving 22.214.171.124 NXPS32 Family: Chip Technology Roadmap 126.96.36.199 NXP Launched Next-generation S32 Computing Platform 188.8.131.52 NXP Autonomous Driving Computing Platform: Bluebox 184.108.40.206 NXP Bluebox Roadmap 220.127.116.11 Cooperation with Kalray 18.104.22.168 NXP’s Opinions on Automotive Electronics Evolution 4.3.6 DCU Chip Vendor: Intel 22.214.171.124 IntelGo 126.96.36.199 Mobileye EyeQ Family Product Roadmap 188.8.131.52 Mobileye EyeQ5 Product Progress 184.108.40.206 Integration between Mobileye EyeQx Product Lines and INTEL System 220.127.116.11 Total Shipments of Mobileye EyeQ Family Chips, 2014-2019 4.3.7 Horizon Robotics 18.104.22.168 Autonomous Driving Processors 22.214.171.124 Performance Parameters of Chips 126.96.36.199 Autonomous Driving Computing Platform 188.8.131.52 Automotive-grade AI Chip Customers 4.3.8 Other Chips for DCU 184.108.40.206 ARM Autonomous Driving Safety Processors 220.127.116.11 ARM Autonomous Driving Cores 18.104.22.168 ARM Industrial Cooperation 22.214.171.124 Infineon Multi-core Microcontrollers (1) 126.96.36.199 Infineon Multi-core Microcontrollers (2) 188.8.131.52 Xilinx FPGA 184.108.40.206 Application of Xilinx FPGA in Autonomous Driving and Industrial Cooperation 220.127.116.11 Xilinx Marched in ADAS/AD Market 18.104.22.168 Customers and Partners
5 Foreign DCU Vendors 5.1 Visteon 5.1.1 Profile 5.1.2 Product Lines 5.1.3 Development Plan for Cockpit Electronics and Autonomous Driving 5.1.4 Business Progress Worldwide, 2019 5.1.5 Business Progress in China, 2019 5.1.6 DCU Business Progress and Expectation, 2019 5.1.7 Autonomous Driving Platform 5.1.8 Progress in Autonomous Driving Business, 2018 5.1.9 Progress in Autonomous Driving Business, 2019 5.1.10 Intelligent Cockpit DCU 5.1.11 Cockpit DCU Application Cases 5.2 Continental 5.2.1 Profile 5.2.2 Business Progress Worldwide, 2019 5.2.3 Layout of Autonomous Driving Product Lines 5.2.4 Autonomous Driving DCUs 5.2.5 Computing Power of Autonomous Driving DCU Chips 5.2.6 Development Plan for Automotive High Performance Computer Platform 5.2.7 Autonomous Driving DCU Partners 5.2.8 Cockpit DCUs 5.2.9 Security DCUs 5.3 Bosch 5.3.1 Business Progress Worldwide, 2019 5.3.2 Layout of Autonomous Driving Product Lines 5.3.3 Prediction of Next-generation Automotive Architecture Evolution 5.3.4 Intelligent Vehicle Multi-domain Architecture 5.3.5 Mixed Framework of ECU for Domain Classification 5.3.6 Autonomous Driving DCU Technology Roadmap 5.3.7 Performance Parameters of Autonomous Driving DCU Products 5.3.8 Development Plan for Autonomous Driving DCU 5.3.9 Development Plan for Computing Power of Autonomous Driving DCU 5.3.10 Comparison of Autonomous Driving DCUs between Bosch and Its Counterparts 5.3.11 Autonomous Driving Software Architecture (1) 5.3.12 Autonomous Driving Software Architecture (2) 5.3.13 Intelligent Cockpit Domain Architecture (1) 5.3.14 Intelligent Cockpit Domain Architecture (2) 5.3.15 Intelligent Cockpit Software R&D Partners 5.4 Veoneer 5.4.1 Business Progress, 2019 5.4.2 Layout of Autonomous Driving Product Lines 5.4.3 Active Safety Platform Architecture and Development Strategy 5.4.4 ADAS Controllers 5.4.5 ADAS/AD ECU 5.4.6 Functional Architecture of ADAS/AD ECU 5.4.7 Autonomous Driving Software Development 5.4.8 New Products Plan, 2019 5.5 ZF 5.5.1 Business Progress and Revenue Structure, 2019 5.5.2 Autonomous Driving DCU Product Plan 5.5.3 Progress in Application of Autonomous Driving DCU in China 5.5.4 Latest-generation Autonomous Driving DCUs 5.5.5 Development Roadmap and Mass-production Plan for Autonomous Driving DCU 5.5.6 Mass-production Plan for L2.5 Automated Driving Solutions 5.5.7 L4 Automated Driving Partners 5.5.8 Cooperation with Xilinx 5.5.9 Cooperation with Microsoft 5.6 Aptiv 5.6.1 Business Progress, 2019 5.6.2 Organizational Structure Adjustment 5.6.3 New Strategic Position 5.6.4 Intelligent Vehicle Architecture Design 5.6.5 Intelligent Vehicle Architecture Design: Features 5.6.6 Intelligent Vehicle Architecture Design: Topology 5.6.7 Intelligent Vehicle Architecture Design: Challenges for Development and Production 5.6.8 Intelligent Vehicle Architecture Design: Software-defined Platform 5.6.9 Intelligent Vehicle Architecture Design: Technological Strengths 5.6.10 Autonomous Driving Computing Platform 5.6.11 Cooperation with Others on DCU Development 5.6.12 Intelligent Cockpit DCUs 5.7 Magna 5.7.1 Business Progress, 2019 5.7.2 Autonomous Driving Product Lines 5.7.3 Autonomous Driving Platform DCUs 5.7.4 Features of Autonomous Driving Platform DCU 5.7.5 Launch of Highly Integrated Autonomous Driving Development Platform 5.8 Tesla Autonomous Driving Platform 5.8.1 Autopilot: Hardware Development Roadmap 5.8.2 Autopilot: Function Upgrade Path 5.8.3 Autopilot: Software Upgrade Path 5.8.4 Features of DCU (1) 5.8.5 Features of DCU (2) 5.8.6 Features of DCU (3) 5.8.7 Features of DCU (4) 5.8.8 Features of DCU (5) 5.8.9 New ECU Architecture 5.8.10 ECU Motherboards for Multimedia and Autonomous Driving 5.8.11 Tesla Model 3 Central Computing Modules 5.8.12 AutoPilot 3.0 Chip 5.9 TTTech 5.9.1 Profile 5.9.2 Autonomous Driving Solutions 5.9.3 Cooperation with Others on Development of Autonomous Driving DCUs 5.9.4 Technological Strengths of Autonomous Driving DCU Platform 5.9.5 Autonomous Driving Safety Software Platform 5.9.6 Cooperation with SAIC 5.10 Faurecia 5.10.1 Faurecia’s Business Progress, 2019 5.10.2 Business Progress of Faurecia Clarion Electronics, 2019 5.10.3 Global Presence of Faurecia Clarion Electronics 5.10.4 Product Lines of Faurecia Clarion Electronics 5.10.5 Ecosystem of Faurecia Clarion Electronics 5.10.6 Faurecia’s Next-generation Cockpit Intelligence Platform (CIP) 5.10.7 Faurecia’s Cockpit Strategic Layout 5.10.8 Faurecia Steps up Deployment of Its Intelligent Cockpit Strategy in China 5.11 Panasonic 5.11.1 Cockpit DCU Solutions 5.11.2 Cockpit Electronics Layout 5.11.3 Cockpit Electronics Computing Architecture
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